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Product Information

Tin Alloys

Bismuth SLOTOSON MB 1880

An acidic electrolyte for the deposition of light grey, Matt Bismuth layers with a good solderability.  The melting point of Pure Bismuth is 271 °C and allows higher solder temperatures than Tin. 

Indium SLOTOSON MI 1930

An  acidic  electrolyte  for  the  deposition  of  White,  Matt  Indium layers with a good solderability.  The melting point of Pure Indium is 156 °C.  The application field of the surface is e.g. the coating of plug-in connectors and press-fit pins.  The electrolyte can be used for rack applications as well as for continuous plating lines. 

Tin-Silver SLOTOLOY SNA 30

Strongly acidic electrolyte for the deposition of Semi-Matt, finely crystalline Tin-Silver alloys with approx. 3% by weight Ag for Reel to Reel, Rack and Barrel systems.

Tin-Bismuth SLOTOLOY SNB 30 1

Strongly acidic electrolyte for the deposition of Semi-Matt Tin-Bismuth alloys with a Bismuth incorporation rate of up to 5% by weight.

Tin-Copper SLOTOLOY SNC 50

An electrolyte on Sulphuric Acid basis for the deposition of Bright Tin-Copper layers with a co-deposition of about 1 - 10 % Cu.  The tendency to form whiskers is reduced.

Tin-Lead SLOTOLET BP 10

A strongly acidic fluoride free process for Bump Plating Tin-Lead solder deposits, containing up to 90% Lead. 

Tin-Lead SLOTOLET G 50 1

Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright Tin-Lead coatings.  Haze-free bright coatings are easily achieved with 5 - 35 % Lead in the alloy.

Tin-Lead SLOTOLET GB 60

Fluoride- and formalin-free electrolyte for the deposition of bright Tin-Lead coatings, primarily for alloys containing 5 - 40 % Lead. Mainly used in reel-to-reel installations.

Tin-Lead SLOTOLET KB 30

An acidic fluoride-free electrolyte which produces matt fine grained Tin-Lead deposits.  Formulated specifically for high speed (such as reel to reel plating of connector pins, IC lead frames or wire plating). 

Tin-Nickel Anthracite SLOTOLOY BNT 2640

Tin-Nickel alloy electrolyte for the deposition of black, even and well-adhering layers over a wide applicable current density range. It is preferably used on Tin-Nickel alloy surfaces. 

Tin-Nickel SLOTOLOY NIT 10

Weakly acidic, fluoride-containing electrolyte for the deposition of shine-preserving layers with an alloy composition of 65% by weight Sn and 35% by weight Ni.

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