Product Infomation
Pre Treatment Include Strippers
Pickling Solution SLOTOCLEAN BZ 50 1
Acid process for dealing with stubborn pickling problems, e.g. degreasing and dissolving scale, carbon, pigments, etc.
Pickle Degreaser SLOTOCLEAN BEF 30
Acid process for removing rust, scale and oxide layers with simultaneous de-oiling/degreasing.
Pickle Degreaser SLOTOCLEAN BEF 1790
Used when the objects to be pickled also have to be de-oiled or degreased at the same time. Recommended for high-tensile Steels.
SLOTETCH 584
Micro-etching, especially for the pre-treatment of Printed Circuit Boards, IC carriers, Copper and Alloy 42 (Nickel/Iron) base material.
Stripper L 60
Two-stage spray process for chemically stripping Tin, Lead and Lead-Tin layers from Copper. Use in continuous systems.
Rack Stripper SLOTOSTRIP VA 1390
Chemical demetallization for Stainless Steels to remove Tin, Lead-Tin, Copper, Bright and Semi-bright Nickel and limited Silver coatings or coating combinations.
Stripper L 80
Two-stage demetallization process for the chemical removal of Tin, Lead and Lead-Tin layers from Copper. Universal use.
Stripper L
Cyanide, alkaline demetallization for the chemical removal of metallic coatings from Steel.
Stripper SLOTOSTRIP IN 2180
Removal of Indium from Copper, Brass and Nickel.
SLOTOCLEAN DF 10
Strongly Alkaline for deflashing of IC lead frames.
Stripper E 40
Electrolytic stripping of Tin, Lead and Tin-Lead deposits from Stainless Steel.
Stripper SLOTOSTRIP SN 2320
Electrolytic stripping of Tin-Nickel layers from Nickel layers.
Zincate CNF 10
Produces a Zinc layer on Aluminium and its alloys which allows for direct plating.
Aluminium Pickle SLOTOCLEAN AK 60
Pickle additive for long-running pickles with Sodium Hydroxide content.
SLOTOCLEAN DS 10 Nitric-Free Desmut
A Nitric Acid free process for removing the smut formed during the etching of Aluminium alloys. The process has a long service life, is easily maintained and has negligible attack on the substrate.
Aluminium Pickle SLOTETCH 590
Acid Aluminium pickle. Especially suitable for Aluminium alloys.
SLOTETCH 30
Copper activation acidic and free from complexing agents applied for the removal of Copper Oxide layers in the PCB technology.
SLOTETCH 20
Weak acidic, fluoride-free activation for Copper alloys which contain small quantities of Silicon and Nickel.